High Power Electronic Component: Review

Ping   H.   Chen; Shyy   W.   Chang; Kuei   F.   Chiang; Ji      Li

Abstract

A large number of recent patents for cooling of high power electronic components are reviewed. Along with the progresses in the developments of material, fabrication, and packaging techniques, various single and two phase cooling devices are developed for thermal managements of electronic devices. In this respect, practical patents for heatsink developments and implementations of nanotechnology and two-phase devices are reviewed through which the innovative concepts matching their future developing trends are disclosed.

Keywords: Heat-sink devices, liquid cooling systems, heat pipes, wick materials, two phase cooling devices, electronic devices, critical heat flux