Relationship Between Temperature Drift and Thermal Expansion of Sensing Structure in Sandwich Micro-Accelerometer

Title:Relationship Between Temperature Drift and Thermal Expansion of Sensing Structure in Sandwich Micro-Accelerometer

Volume: 6 Issue: 1

Author(s): Dai Qiang, Jiang Gang, Su Wei, Zhang De and Peng Bo

Affiliation:

Keywords: Sandwich micro-accelerometer, sensing structure, temperature drift, thermal expansion.

Abstract: To cope with the temperature drift of capacitive sandwich type micro-accelerometer, based on mechanics and thermal principle, mechanics equilibrium of sensing structure after thermal expansion is obtained. Then, in light of the accelerometer’s closed loop operation mode, the electrical equilibrium is obtained. On the basis of two equilibriums, the output drift induced by thermal expansion of sensing structure is attained, which implies that the drift is less than 0.002 g_n per 10^oC. Meanwhile, an experiment is conducted which indicates that the drift due to the temperature is from 0.1 g_n to 0.2 g_n per 10^oC. The comparison implies that the thermal expansion of sensing structure is not a dominant reason for temperature drift of the accelerometer.

Cite this article as:

Qiang Dai, Gang Jiang, Wei Su, De Zhang and Bo Peng, Relationship Between Temperature Drift and Thermal Expansion of Sensing Structure in Sandwich Micro-Accelerometer, Micro and Nanosystems 2014; 6 (1) . https://dx.doi.org/10.2174/187640290601140919144733