Suitable Conditions for Effective Inter Chip Communication based on Surface Wave Phenomenon

(E-pub Abstract Ahead of Print)

Author(s): Mahaveer Penna*, Shiva Shankar, Keshava Murthy, Jijesh J J

Journal Name: Recent Advances in Electrical & Electronic Engineering
Formerly Recent Patents on Electrical & Electronic Engineering


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Abstract:

Background: The communication between two Integrated Circuits (IC) of the Printed Circuit Boards (PCB) currently happening through copper traces which allow electric charge to flow. Several limitations being encountered with the copper traces during high data rate communication because of the resistivity factors, which eventually leads to the damage of traces and the system.

Methods: The solution for this issue comes with the design of surface wave communication-based waveguide/channel between the IC’s. Surface wave communication over a specified communication fabric/channel performs the propagation of electromagnetic waves effectively even at high frequencies compared to the copper traces using conductor-dielectric combination. This paper deals in revealing suitable conditions through profound analytical models for achieving effective surface wave communication between the pins of integrated circuits.

Results: The analysis includes defining the possible wave propagation terms, suitable channel design aspects for PCB application and corresponding analysis for effective communication at frequencies from 50GHz to 500GHz of millimeter range. This study provides the roadmap to explore a deterministic channel/fabric for pin to pin communication between the IC’s as an alternate for the copper traces.

Conclusion: In this process, the proposed channel achieves low dispersion compared to the copper traces at millimeter frequency range.

Keywords: IC, PCB, Waveguide, Communication Fabric, attenuation, copper.

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Article Details

(E-pub Abstract Ahead of Print)
DOI: 10.2174/2352096514666210224152835
Price: $95