Author(s): Seongah Chin Sungkyul University Anyang City, South Korea
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Journal Name: Recent Patents on Engineering
Volume 13 , Issue 2 , 2019
DOI : 10.2174/187221211302190524115116
Title:Meet Our Associate Editorial Board Member
VOLUME: 13 ISSUE: 2
Author(s):Seongah Chin
Affiliation:Sungkyul University Anyang City
Cite this article as:
Seongah Chin, “Meet Our Associate Editorial Board Member”, Recent Patents on Engineering (2019) 13: 93. https://doi.org/10.2174/187221211302190524115116
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