Search Result "solder"


Investigations on Vapor Phase Soldering Process in an Experimental Soldering Station

Journal: Micro and Nanosystems
Volume: 2 Issue: 3 Year: 2010 Page: 170-177
Author(s): Attila Geczy, Zsolt Illyefalvi-Vitez, Peter Szoke

Formation and Distribution of Sn-Cu IMC in Lead-Free Soldering Process Induced by Laser Heating

Journal: Micro and Nanosystems
Volume: 2 Issue: 3 Year: 2010 Page: 178-184
Author(s): Tamas Hurtony, Balint Balogh, Peter Gordon

Research Article

Experimental Investigation of Microstructural Effects in Sn-Pb Solder Accumulated During Ten Years of Service Life

Journal: Micro and Nanosystems
Volume: 13 Issue: 2 Year: 2021 Page: 170-179
Author(s): Marek Werner,Kerstin Weinberg

Investigating the Influence of Uneven Printed Wiring Board Surface on Volume Increment of Deposited Solder Pastes

Journal: Micro and Nanosystems
Volume: 2 Issue: 3 Year: 2010 Page: 163-169
Author(s):

Mapping Heat Conduction Ability of Big SMDs with Dijsktra Algorithm

Journal: Micro and Nanosystems
Volume: 2 Issue: 3 Year: 2010 Page: 185-192
Author(s): Balazs Illes, Gabor Harsanyi

Illumination Optimization for Quasi-Tombstone Detection

Journal: Micro and Nanosystems
Volume: 2 Issue: 3 Year: 2010 Page: 149-162
Author(s): Mihaly Janoczki, Andras Borbiro, Sandor Nagy, Laszlo Jakab

Review Article

A Review of Developments in Au-Sn Eutectic Alloy Electrodeposition

Journal: Innovations in Corrosion and Materials Science
Volume: 8 Issue: 1 Year: 2018 Page: 3-23
Author(s): O.N. Vrublevskaya

Manufacturing of Orthodontic Brackets: A Review of Metallurgical Perspectives and Applications

Journal: Recent Patents on Materials Science
Volume: 1 Issue: 2 Year: 2008 Page: 135-139
Author(s): Theodore Eliades, Spiros Zinelis, Christoph Bourauel, George Eliades

Review Article

Thermal Interface Materials Based on Vertically Aligned Carbon Nanotube Arrays: A Review

Journal: Micro and Nanosystems
Volume: 11 Issue: 1 Year: 2019 Page: 3-10
Author(s): Guangjie Yuan,Haohao Li,Bo Shan,Johan Liu

Prototyping of a Reliable 3D Folded Package by Laser Micromachining

Journal: Micro and Nanosystems
Volume: 1 Issue: 2 Year: 2009 Page: 133-138
Author(s): Richard Berenyi

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