Abstract
This article reviews dozens of recently published patents, patent applications and journal papers for the recent developments in wire bonding for advanced microelectronics interconnections. The problems or challenges related to popular topics such as low-k devices, ultra-fine-pitch wire bonding, insulated wire bonding, low wire loops and copper wire bonding are briefly explained, and a number of new solutions to the problems and recent findings/developments are summarized.
Keywords: Microelectronics interconnections, wire bonding, low-k devices, ultra-fine pitch, copper wire, insulated wire, low wire loops
Recent Patents on Engineering
Title: Recent Developments in Wire Bonding
Volume: 1 Issue: 3
Author(s): Zhao W. Zhong
Affiliation:
Keywords: Microelectronics interconnections, wire bonding, low-k devices, ultra-fine pitch, copper wire, insulated wire, low wire loops
Abstract: This article reviews dozens of recently published patents, patent applications and journal papers for the recent developments in wire bonding for advanced microelectronics interconnections. The problems or challenges related to popular topics such as low-k devices, ultra-fine-pitch wire bonding, insulated wire bonding, low wire loops and copper wire bonding are briefly explained, and a number of new solutions to the problems and recent findings/developments are summarized.
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Cite this article as:
Zhong W. Zhao, Recent Developments in Wire Bonding, Recent Patents on Engineering 2007; 1 (3) . https://dx.doi.org/10.2174/187221207782411610
DOI https://dx.doi.org/10.2174/187221207782411610 |
Print ISSN 1872-2121 |
Publisher Name Bentham Science Publisher |
Online ISSN 2212-4047 |
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