Electroplating Copper Mask for Glass Deep Wet Etching in MEMS Relay
Xiaodan Miao, Xuhan Dai, Dongming Fang, Guifu Ding and Xiaolin Zhao
Pages 165-169 (5)
This paper reports an electroplated copper mask technology which consists of sputtered chromium and copper
seed layer with electroplated copper and gold layer, in combination with hard baked thick AZ4620 photoresist based on
MEMS technology. The etching depth attains to 680μm after more than 3 hours’ immerging in the concentrated HF 48%
etching solution with smooth generated surface without pinholes. In addition, undercut ratio of 0.87 could be achieved.
Compared with other masks in the literature, this electroplating mask technology is characterized by lithography
compatibility, simple, low cost, short time consumption, large undercut ratio as well as smooth generated surface. Thus, it
can be used in MEMS fields such as: precisely assignment of permanent magnet for the electromagnetic microrelay.
Micromachining, Pyrex glass, Etching, Lithography, MEMS
National Key Laboratory of Nano/Micro Fabrication Technology Research Institute of Micro/Nanometer Science and Technology, Shanghai Jiao Tong University, Shanghai 200240, China