Recent Patents on Mechanical Engineering

Khurshid Zaman  
Bentham Science Publishers


Recent Patents in Fluid Dispensing Processes for Electronics Packaging

Author(s): Minggan Li and Xiongbiao Chen

Affiliation: Department of Mechanical Engineering, University of Saskatchewan, Saskatoon, SK, S7N 5A9, Canada.


Fluid dispensing is a process to deliver fluid materials in a controlled manner. This method has been widely used in various processes/applications such as electronics assembly and microelectromechanical systems (MEMS) packaging. With an increasing demanding for smaller size and higher density of components on boards, numerous efforts have been made in industry to enhance the efficiency and accuracy of the dispensing process and some of the techniques resulted have been patented. This paper presents an overview of the recent patents in the dispensing approaches, and the dispensing process measurements and control in electronic packaging.

Keywords: Fluid dispensing, packaging, control, viscosity, measurements, volume or amount

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Article Details

Page: [19 - 25]
Pages: 7
DOI: 10.2174/2212797610902010019