On the Chemo-Mechanical Polishing for Nano-Scale Surface Finish of Brittle Wafers

Author(s): Y.G. Wang, L. C. Zhang.

Journal Name: Recent Patents on Nanotechnology

Volume 4 , Issue 2 , 2010

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Chemo-mechanical polishing (CMP) has been a common method to produce nano-scale surface finish of brittle wafers. This paper provides a relatively comprehensive review on the CMP of silicon, silicon carbide and sapphire including both patents and papers. The discussion includes the limitations and further research directions of the CMP technology, the material removal mechanisms, and the control and optimization of the CMP for brittle wafers. The paper concluded that the usage of mix- or coated- abrasives may improve the CMP in terms of less subsurface damage and higher material removal rate.

Keywords: Brittle wafer, CMP, Silicon, Silicon carbide, sapphire

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Article Details

Year: 2010
Page: [70 - 77]
Pages: 8
DOI: 10.2174/187221010791208812
Price: $65

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