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Behavior of Nanocracks on Micro/Nano-Interfacial Structure Under Thermal Flux Conditions

Author(s): Ningbo Liao, Ping Yang, G. Q. Zhang, L. J. Ernst.

Abstract:

The interfaces of dissimilar materials suffer high stress gradients due to the presence of thermal and stiffness mismatches of bonded materials. Interfaces of dissimilar materials are prone to crack initiations, leading to delaminations. The atomistic effects have to be taken into account correctly when the system becomes extremely small such as in nano-scale. The experimental test for this scale situation is an impossible expectation because the helpless experimental technologies in present time. So the simulation under atomic model is a cogent means to investigate the behavior of nanocracks on micro/nano-interfacial structure. In this paper, an atomic model is proposed to investigate the effect of nanocracks on interfacial behavior under thermal flux conditions. The simulations results show the propagation mechanisms of cracks and the corresponding change of temperature distribution in the heat transfer process. The comparison on the thermal flux for cases of cracks added and cracks free is also presented.

Keywords: Nanocracks, behavior, micro/nano-interfacial structure, thermal flux conditions

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Article Details

VOLUME: 5
ISSUE: 3
Year: 2009
Page: [335 - 338]
Pages: 4
DOI: 10.2174/157341309788921408
Price: $58