A qualitative observation has been undergone to review the various geometries of a
microchannel that has been reported for the last two decades in literature majorly for the application of
high power devices. Recent research on microchannel is more focused on numerical and experimental
work with various configurations of the heat sink. In this paper, a comparative work on different flow
geometries used in the microchannel and their influence on heat transfer and pressure drop is investigated
with the brief representation of different working fluids used in microchannel heat sink for the
purpose of electronic cooling and their associated performance characteristics with various examined
Background: The microchannel cooling is an established cooling technique for high power electronic
components which effectively enhances the performance of the high power devices.
Objective: This article presents a general overview of microchannels with novel constructional bifurcations
structures with related patents. Further, the influential parameter on thermal and flow characteristics
with greater depth is also reviewed by authors.
Methods: This review directs by presenting standard and benchmark investigation in the microchannel
and different working parameters continued with recent studies. Further, it is addressed with the application
of electronic cooling with latest patents using bifurcations and fractal microchannels.
Result: The current situation of 3D cooling requires a robust cooling system to accommodate increased
heat flux without compromising the packaging. Moreover, the recently developed patents also evolved
with improved thermal load handling under constrained packaging.
Conclusion: The advanced microchannel cooling with an optimized fluid handling system with effective
packaging results in a highly effective heat dissipation system.