Background: Crosstalk will be a major concern in future nano ICs where the components
will be scaled down to a few nanometers. In particular, modeling of CNT based interconnects shows
that they will suffer from crosstalk when fabricated at smaller technology nodes.
Objective: This paper presents reduction of crosstalk and noise in CNT bundle interconnects. We propose
the use of small diameter semiconducting CNTs (s-CNTs) as electromagnetic interference (EMI)
shields for CNT bundle interconnects.
Methods: The coupling capacitance of the proposed CNT bundle structure shows that crosstalk can be
reduced significantly by using small diameter s-CNTs. We perform SPICE analysis to show the reduction
in crosstalk and peak noise.
Results: The proposed bundle geometry reduces 46% crosstalk induced delay and 23% output peak
noise as compared to conventional CNT interconnects.
Conclusions: Small diameter semiconducting CNTs can be used as EMI shields to reduce crosstalk and
noise in CNT interconnects.