Wire bonding is still the dominant form of electronic packaging for its mature
technology, low cost and high reliability. The development trend of electronic
components is: small volume, high power, high frequency and high reliability. With
the improvement of signal transmission frequency and device power, bonding wire
cannot be regarded as simple transmission line with no loss. In this paper, the latest
research status and various patents of wire bonding electromagnetic characteristics are summarized in three aspects: bonding
wire, wire layout and packaging structure. The factors affecting the electromagnetic characteristics are summarized
and several resolutions are proposed to improve the electrical properties. In the meantime, the prospect and development
trends are described in this paper. With the study of bonding wire loop technology and electromagnetic properties, the
wire bonding form can continue to meet the requirements of encapsulation process and be dominant solution of low cost
encapsulation in a long time.
Keywords: Crosstalk, electrical connection, electromagnetic characteristics, electronic packaging, wire bonding, wire geometry.
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