Abstract
Wire bonding is still the dominant form of electronic packaging for its mature technology, low cost and high reliability. The development trend of electronic components is: small volume, high power, high frequency and high reliability. With the improvement of signal transmission frequency and device power, bonding wire cannot be regarded as simple transmission line with no loss. In this paper, the latest research status and various patents of wire bonding electromagnetic characteristics are summarized in three aspects: bonding wire, wire layout and packaging structure. The factors affecting the electromagnetic characteristics are summarized and several resolutions are proposed to improve the electrical properties. In the meantime, the prospect and development trends are described in this paper. With the study of bonding wire loop technology and electromagnetic properties, the wire bonding form can continue to meet the requirements of encapsulation process and be dominant solution of low cost encapsulation in a long time.
Keywords: Crosstalk, electrical connection, electromagnetic characteristics, electronic packaging, wire bonding, wire geometry.
Recent Patents on Mechanical Engineering
Title:Recent Research of Electromagnetic Characteristics in Wire Bonding
Volume: 9 Issue: 2
Author(s): Wenchao Tian and Haoyue Ji
Affiliation:
Keywords: Crosstalk, electrical connection, electromagnetic characteristics, electronic packaging, wire bonding, wire geometry.
Abstract: Wire bonding is still the dominant form of electronic packaging for its mature technology, low cost and high reliability. The development trend of electronic components is: small volume, high power, high frequency and high reliability. With the improvement of signal transmission frequency and device power, bonding wire cannot be regarded as simple transmission line with no loss. In this paper, the latest research status and various patents of wire bonding electromagnetic characteristics are summarized in three aspects: bonding wire, wire layout and packaging structure. The factors affecting the electromagnetic characteristics are summarized and several resolutions are proposed to improve the electrical properties. In the meantime, the prospect and development trends are described in this paper. With the study of bonding wire loop technology and electromagnetic properties, the wire bonding form can continue to meet the requirements of encapsulation process and be dominant solution of low cost encapsulation in a long time.
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Cite this article as:
Tian Wenchao and Ji Haoyue, Recent Research of Electromagnetic Characteristics in Wire Bonding, Recent Patents on Mechanical Engineering 2016; 9 (2) . https://dx.doi.org/10.2174/2212797609666160309003015
DOI https://dx.doi.org/10.2174/2212797609666160309003015 |
Print ISSN 2212-7976 |
Publisher Name Bentham Science Publisher |
Online ISSN 1874-477X |
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