Micro Flat Heat Pipes for Microelectronics Cooling: Review
Lu C. Lv and Ji Li
Affiliation: Laboratory of Advanced Thermal Management Technologies, College of Physics, University of Chinese Academy Sciences, 19A Yuquanlu Road, Shijingshan District, Beijing 100049, P.R. China
Keywords: Electronics cooling, high heat flux, micro flat heat pipe, modeling, novel designs, wick structure.
A review of recent patents and academic articles on micro flat heat pipes over the past decade is presented
herein. Firstly, the development history of the mathematical models of the micro flat heat pipes is chronologically summarized.
Then, some major investigations in the micro flat heat pipes, both experimental and theoretical, are summed up. Besides,
some innovative ideas and novel micro flat heat pipe designs for particular applications are also documented along
with comparisons and discussion on various cross-sectional shapes and designs of wick structure, such as grooves, sintered
powders, nanotubes and their combinations. Finally, the challenges in the research of micro flat heat pipes are discussed
briefly and the development tendency is prospected according to the existing achievements.
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