Feasibility of Suitable Decoupling Component for QSCC
Pp. 100-108 (9)
The improvement of the decoupling performance of PDN will have the highest
priority for forming QSCC. The result of the feasibility study of the suitable decoupling
component is presented.
Low-impedance line structure component (LILC), QSCC, EMI, PDN,
EMW, AC circuit, terminal impedance, transmission coefficient, chip ceramic
LILC, multi-layers chip ceramic LILC, strip line, Pb (Zr, Ti) 03 system, loss tanδ,
ceramic cylinder LILC, FPGA, solid aluminum LILC, carbon paste, conductive
polymer, carbon graphite, etched aluminum film.
ICAST, Inc. Hachioji-shi, Tokyo192-0912 Japan.