The objective of this paper is to provide a systematic investigation on design or evaluation for W/Al interface structure in micro/
nano electronic manufacturing. To understand the basic mechanical properties of the W/Al interface structure, the elastic modulus
and the hardness of the sample were investigated by nanoindentation. To investigate the integrating characteristics of the sample in progress,
the effect of thermal loading and no-thermal loading on the integrating force of the W/Al interface is tested by nanoscratch. The interfacial
bonding force between the films can be obtained for understanding the integrating characteristics. The results show that the interfacial
bonding force can be improved by thermal loading, which means the mechanical properties of W/Al interface can be modulated
and modified by using thermal loading. It is significant for design and industrial manufacturing process of W/Al interface structure.
Keywords: W/Al interface structure, nanoindentation, nanoscratch, mechanical properties.
Rights & PermissionsPrintExport