Developments and Recent Patents on Nano-Imprint Lithography Techniques
Changhe Li, YuPing Wei and Sheng Wang
Affiliation: School of Mechanical Engineering, Qingdao Technological University, 266033 Qingdao, P.R. China.
Keywords: Electron beam direct writing, hot embossing lithography, integrated circuit, micro-contact printing, nano-imprint
lithography (NIL), replicating technology, ultra violet nano-imprint lithography
In recent years, large numbers of patents have been devoted to developing the nano-imprint lithography (NIL)
process techniques for significant improvement in both nano-fabrication precision and feature size of the template pattern.
Nano-imprint lithography is one of the most promising patterning technologies, in which nano- and micro-patterns are
fabricated on various substrates. Nano-imprint pattern transfer is to let the resist flow and then fill in the cavity structure
of the feature pattern on the surface of the mold by the compression of the mold; after completing the filling, make the
resist continue thinning under the pressure to the extent permitted by the follow-up processes; then stop the compression
and cure the resist. Adopting the traditional pattern replicating technology with the advantages of high throughput, low
cost and simple process, nano-imprint lithography has become an important fabrication technology for nano-scale
electronic devices. Based on the description of the constituent elements of the nano-imprint lithography, this paper makes
a brief introduction of several traditional imprint technology processes and their varieties which were hot embossing
lithography, ultra violet nano-imprint lithography, micro-contact printing and summarizes the key technique issues
involved in the nano-imprint lithography, and analyzes the challenges faced in the application of this process in
fabricating the integrated circuit.
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